CAN1 Custom Aluminum Nitride Ceramic Circuit Board and Alumina Substrate Heat Sink with High Thermal Conductivity for Research Chip Carrier Applications - Image 1
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    CAN1 Custom Aluminum Nitride Ceramic Circuit Board and Alumina Substrate Heat Sink with High Thermal Conductivity for Research Chip Carrier Applications

    $83.00

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    Description
    Potentiolab • Aluminum Nitride Ceramic Substrate

    Aluminum Nitride Ceramic Circuit Board Chip Carrier Heat Sink

    High thermal conductivity aluminum nitride ceramic circuit board designed for chip carriers, chip packaging, electronic packaging, and high-performance heat dissipation applications.

    AlN Ceramic170 W/(m·K)

    High Thermal Conductivity

    aluminum nitride ceramic circuit board chip carrier high thermal conductivity heat sink substrate
    High Thermal Conductivity AlN Ceramic
    • Substrate material: Aluminum Nitride (AlN)
    • Thermal conductivity: 170 W/(m·K)
    • Excellent heat dissipation capability
    • Suitable for high-power electronic packaging
    Stable Ceramic Structure
    • Overall size: 20mm × 20mm × 0.5mm
    • Excellent mechanical stability
    • High temperature resistance
    • Reliable long-term performance
    Ti/Cu/Ni/Au Metal Layer
    • Metal layer structure: Ti/Cu/Ni/Au
    • Excellent conductivity and bonding performance
    • Suitable for electronic packaging processes
    • Stable multilayer metallization system
    Wide Operating Temperature
    • Operating temperature: -50°C to 350°C
    • Suitable for harsh environments
    • Excellent thermal stability
    • Reliable heat sink performance
    Typical Applications
    • Electronic packaging
    • Chip carriers and chip supports
    • High-power heat sink substrates
    • Semiconductor device packaging
    • Thermal management systems
    ItemSpecification
    Product NameAluminum Nitride Ceramic Circuit Board Heat Sink
    Substrate MaterialAluminum Nitride Ceramic (AlN)
    Thermal Conductivity170 W/(m·K)
    Overall Size20mm × 20mm × 0.5mm
    Metal Layer StructureTi/Cu/Ni/Au
    Metal Layer ThicknessTi 0.1μm / Cu 50μm / Ni 3μm / Au 0.075μm
    Operating Temperature-50°C to 350°C
    Product Advantages
    This aluminum nitride ceramic circuit board combines high thermal conductivity, stable ceramic structure, and Ti/Cu/Ni/Au multilayer metallization technology. It is suitable for chip carriers, electronic packaging, thermal management, and high-power heat dissipation applications requiring reliable performance and stable quality.
    Precautions
    • Handle carefully to avoid scratching the metallized surface.
    • Avoid mechanical impact or excessive stress on the ceramic substrate.
    • Keep the surface clean before soldering or bonding processes.
    • Store in a clean, dry, and dust-free environment.
    • Custom dimensions and metallization structures are available upon request.
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    Shipping and Delivery

    Worldwide Shipping

    Potentiolab ships electrochemical electrodes, electrochemical cells, and laboratory accessories to universities, research institutes, and laboratories worldwide. Orders are shipped primarily via FedEx International Priority (occasionally DHL or UPS) with full tracking. In-stock items are typically dispatched within one business day. Estimated delivery times are 4–6 working days for Asia, 5–7 working days for Europe and North America, and 7–9 working days for other regions. Customs clearance times may vary by country.

    Rates, Support & Orders

    Shipping fees start from USD 28, with free shipping available on qualifying orders over USD 1800. Prices exclude VAT, customs duties, or local taxes, which are the responsibility of the recipient. For bulk orders, custom electrochemical products, academic discounts, or institutional purchasing requirements, please contact our sales team at sales@potentiolab.com.

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